This paper presents a new approach to achieve elementary neighborhood operations on both 2D and 3D binary images by using the Extreme Vertices Model (EVM), a recent orthogonal pol...
3D CAD is replacing 2D CAD to improve efficiency of product design and manufacturing. Therefore, converting legacy 2D drawings into 3D solid models is required. CSG based approach...
This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, ...
Recently, the number of applications developed for smartphones has dramatically increased; however, at the moment, applications having the purpose of creating and displaying 3D mo...
In this paper, we present a novel technique that enables capturing of detailed 3D models from flash photographs integrating shading and silhouette cues. Our main contribution is ...