2841 search results - page 220 / 569 » A Call to Order |
174
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ICCD
2004
IEEE
16 years 4 months ago
2004
IEEE
This short paper explores an implementation of a new technology called 3D die stacking and describes research activity at Intel. 3D die stacking is the bonding of two die either f...
180
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ICCAD
2004
IEEE
16 years 4 months ago
2004
IEEE
Improving logic capacity by time-sharing, dynamically reconfigurable FPGAs are employed to handle designs of high complexity and functionality. In this paper, we model each task ...
231
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WEA
2010
Springer
16 years 2 months ago
2010
Springer
A tanglegram consists of a pair of (not necessarily binary) trees T1, T2 with leaf sets L1, L2. Additional edges, called tangles, may connect nodes in L1 with those in L2. The task...
209
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ICEIS
2009
IEEE
16 years 1 months ago
2009
IEEE
Many researchers in the software agent field use the financial domain as a test bed to develop adaptation, cooperation and learning skills of software agents. However, there are no...
202
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ICRA
2009
IEEE
16 years 1 months ago
2009
IEEE
— In order to construct three-dimensional shape models of large-scale architectural structures using a laser range finder, a number of range images are taken from various viewpo...