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174
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DATE
2009
IEEE
16 years 2 months ago
2009
IEEE
Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
185
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GLOBECOM
2009
IEEE
16 years 2 months ago
2009
IEEE
—The IEEE 802.15.4 standard has no provisions for rate sensitive applications because of its ability to operate in pure CSMA/CA or TDMA modes. Some operating scenarios for rate-s...
222
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ICASSP
2009
IEEE
16 years 2 months ago
2009
IEEE
A two microphone direction of arrival (DOA) estimation technique for multiple speech sources is developed which exploits speech specific properties, namely sparsity in time-frequ...
170
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IROS
2009
IEEE
16 years 2 months ago
2009
IEEE
— When analyzed in the tangential speed domain, human movements exhibit a multi-peaked speed profile which is commonly interpreted as evidence for submovements. At slow speeds, ...
179
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ATAL
2009
Springer
16 years 2 months ago
2009
Springer
In large, collaborative, heterogeneous teams, team members often collect information that is useful to other members of the team. Recognizing the utility of such information and d...