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ICCAD
2009
IEEE
109views Hardware» more  ICCAD 2009»
15 years 5 months ago
Energy reduction for STT-RAM using early write termination
The emerging Spin Torque Transfer memory (STT-RAM) is a promising candidate for future on-chip caches due to STT-RAM's high density, low leakage, long endurance and high acce...
Ping Zhou, Bo Zhao, Jun Yang 0002, Youtao Zhang
ICCAD
2009
IEEE
118views Hardware» more  ICCAD 2009»
15 years 5 months ago
Memory organization and data layout for instruction set extensions with architecturally visible storage
Present application specific embedded systems tend to choose instruction set extensions (ISEs) based on limitations imposed by the available data bandwidth to custom functional un...
Panagiotis Athanasopoulos, Philip Brisk, Yusuf Leb...
ICCAD
2009
IEEE
154views Hardware» more  ICCAD 2009»
15 years 5 months ago
Pad assignment for die-stacking System-in-Package design
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
ICIP
2009
IEEE
15 years 5 months ago
Improving the quality of depth image based rendering for 3D Video systems
In 3D Video (3DV) applications, a reduced number of views plus depth maps are transmitted or stored. When there is a need to render virtual views in between the actual views, the ...
Zefeng Ni, Dong Tian, Sitaram Bhagavathy, Joan Lla...
ICIP
2009
IEEE
15 years 5 months ago
Robust 3D pose estimation from multiple video cameras
In this paper, we introduce a method to estimate the object's pose from multiple video cameras. We derive a centralized solution to pose estimation from multiple video camera...
Chong Chen, Dan Schonfeld
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