Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
We consider self-stabilizing and self-organizing distributed construction of a spanner that forms an expander. The following results are presented. • A randomized technique to r...
We address power minimization of earliest deadline first and ratemonotonic schedules by voltage and frequency scaling. We prove that the problems are NP-hard, and present (1+ ) f...
Recent advances in polyhedral compilation technology have made it feasible to automatically transform affine sequential loop nests for tiled parallel execution on multi-core proce...
Static DHT topologies influence important features of such DHTs such as scalability, communication load balancing, routing efficiency and fault tolerance. Nevertheless, it is co...