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GLVLSI
2005
IEEE
120views VLSI» more  GLVLSI 2005»
16 years 15 days ago
3D module placement for congestion and power noise reduction
3D packaging via System-On-Package (SOP) is a viable alternative to System-On-Chip (SOC) to meet the rigorous requirements of today’s mixed signal system integration. In this wo...
Jacob R. Minz, Sung Kyu Lim, Cheng-Kok Koh
DSVIS
2005
Springer
16 years 13 days ago
Towards Model Checking Stochastic Aspects of the thinkteam User Interface
Abstract. Stochastic model checking is a recent extension of traditional modelchecking techniques for the integrated analysis of both qualitative and quantitative system properties...
Maurice H. ter Beek, Mieke Massink, Diego Latella
MIDDLEWARE
2004
Springer
16 years 7 days ago
Transparent Information Dissemination
This paper explores integrating self-tuning updates and sequential consistency to enable transparent replication of large-scale information dissemination services. We focus our at...
Amol Nayate, Michael Dahlin, Arun Iyengar
EDOC
2003
IEEE
16 years 5 days ago
An Agent-based Architecture for Analyzing Business Processes of Real-Time Enterprises
As the desire for business intelligence capabilities for e-business processes expands, existing workflow management systems and decision support systems are not able to provide co...
Jun-Jang Jeng, Josef Schiefer, Henry Chang
HICSS
2003
IEEE
120views Biometrics» more  HICSS 2003»
16 years 5 days ago
Evaluating On-line Learning Platforms: a Case Study
Our “information-oriented” society shows an increasing exigency of life-long learning. In such framework, online Learning is becoming an important tool to allow the flexibilit...
Francesco Colace, Massimo De Santo, Mario Vento