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DAC
2012
ACM
13 years 10 months ago
Chip/package co-analysis of thermo-mechanical stress and reliability in TSV-based 3D ICs
In this work, we propose a fast and accurate chip/package thermomechanical stress and reliability co-analysis tool for TSV-based 3D ICs. We also present a design optimization meth...
Moongon Jung, David Z. Pan, Sung Kyu Lim
239
Voted
AMC
2010
175views more  AMC 2010»
15 years 7 months ago
An inexact parallel splitting augmented Lagrangian method for large system of linear equations
: Parallel iterative methods are powerful tool for solving large system of linear equations (LEs). The existing parallel computing research results are focussed mainly on sparse sy...
Zheng Peng, DongHua Wu
208
Voted
AUTOMATICA
2007
116views more  AUTOMATICA 2007»
15 years 7 months ago
Periodic input estimation for linear periodic systems: Automotive engine applications
In this paper, we consider periodic linear systems driven by T0-periodic signals that we desire to reconstruct. The systems under consideration are of the form ˙x =A(t)x +A0(t)w(...
Jonathan Chauvin, Gilles Corde, Nicolas Petit, Pie...
BIOSYSTEMS
2008
107views more  BIOSYSTEMS 2008»
15 years 7 months ago
The linearity of emergent spectro-temporal receptive fields in a model of auditory cortex
The responses of cortical neurons are often characterized by measuring their spectro-temporal receptive fields (strfs). The strf of a cell can be thought of as a representation of...
Martin Coath, Emili Balaguer-Ballester, Sue L. Den...
BMCBI
2010
176views more  BMCBI 2010»
15 years 7 months ago
Reverse engineering gene regulatory network from microarray data using linear time-variant model
nd: Gene regulatory network is an abstract mapping of gene regulations in living cells that can help to predict the system behavior of living organisms. Such prediction capability...
Mitra Kabir, Nasimul Noman, Hitoshi Iba