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MR
2002
100views Robotics» more  MR 2002»
15 years 7 months ago
No-flow underfill flip chip assembly--an experimental and modeling analysis
In the flip-chip assembly process, no-flow underfill materials have a particular advantage over traditional underfill: the application and curing of the former can be undertaken b...
Hua Lu 0003, K. C. Hung, Stoyan Stoyanov, Chris Ba...
IJRR
2010
130views more  IJRR 2010»
15 years 5 months ago
CAD Model-based Tracking and 3D Visual-based Control for MEMS Microassembly
This paper investigates sequential robotic microassembly for the construction of 3D micro-electro-mechanical systems (MEMS) structures using a 3D visual servoing approach. The pre...
Brahim Tamadazte, Éric Marchand, Sounkalo D...
SERA
2010
Springer
15 years 5 months ago
Process Patterns for MDA-Based Software Development
—Information systems are expected to satisfy increasingly ambitious requirements, while reducing time–to–market has become a primary objective. This trend has necessitated th...
Mohsen Asadi, Naeem Esfahani, Raman Ramsin
ESAW
2004
Springer
16 years 19 days ago
Semantically Federating Multi-agent Organizations
We believe that successful co-operation between multi-agent systems providing services in a specific domain can be realized by constructing an infrastructure that supports the sem...
Riza Cenk Erdur, Oguz Dikenelli, Inanç Seyl...
CSCW
2004
ACM
16 years 20 days ago
Introducing collaboration into an application development environment
We present contextual collaboration, an approach to building collaborative systems that embeds collaborative capabilities into core applications, and discuss its advantages. We de...
Susanne Hupfer, Li-Te Cheng, Steven Ross, John F. ...