In the flip-chip assembly process, no-flow underfill materials have a particular advantage over traditional underfill: the application and curing of the former can be undertaken b...
Hua Lu 0003, K. C. Hung, Stoyan Stoyanov, Chris Ba...
This paper investigates sequential robotic microassembly for the construction of 3D micro-electro-mechanical systems (MEMS) structures using a 3D visual servoing approach. The pre...
—Information systems are expected to satisfy increasingly ambitious requirements, while reducing time–to–market has become a primary objective. This trend has necessitated th...
We believe that successful co-operation between multi-agent systems providing services in a specific domain can be realized by constructing an infrastructure that supports the sem...
We present contextual collaboration, an approach to building collaborative systems that embeds collaborative capabilities into core applications, and discuss its advantages. We de...
Susanne Hupfer, Li-Te Cheng, Steven Ross, John F. ...