5107 search results - page 284 / 1022 » Design Issue Of ECTST |
245
click to vote
DAC
2011
ACM
14 years 7 months ago
2011
ACM
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...
203
click to vote
FDL
2011
IEEE
14 years 7 months ago
2011
IEEE
—For the description of reactive systems, there is a large number of languages and formalisms, and depending on a particular application or design phase, one of them may be bette...
226
click to vote
DAC
2003
ACM
16 years 8 months ago
2003
ACM
Interconnects have been shown to be a dominant source of energy consumption in modern day System-on-Chip (SoC) designs. With a large (and growing) number of electronic systems bei...
266
click to vote
DATE
2006
IEEE
16 years 1 months ago
2006
IEEE
same level of system-level CAD support that is now commonplace in the IC industry.Recent advances in microfluidics are expected to lead to sensor systems for high-throughput bioche...
161
click to vote
SERP
2007
15 years 8 months ago
2007
– The use of design patterns such as the GRASP (General Responsibility Assignment Software Principles) or GoF (Gang-of-Four) patterns in software engineering has been well-docume...