150 search results - page 1 / 30 » Design and CAD for 3D integrated circuits |
108
Voted
DAC
2008
ACM
16 years 7 months ago
2008
ACM
155
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GLVLSI
2009
IEEE
2009
IEEE
On the complexity of graph cuboidal dual problems for 3-D floorplanning of integrated circuit design
16 years 1 months ago
This paper discusses the impact of migrating from 2-D to 3-D on floorplanning and placement. By looking at a basic formulation of graph cuboidal dual problem, we show that the 3-...
152
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ISVLSI
2003
IEEE
15 years 11 months ago
2003
IEEE
Three-dimensional integration technologies have been proposed in order to mitigate design challenges posed by deep-submicron interconnect. By providing multiple layers of active d...
211
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SLIP
2009
ACM
16 years 29 days ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...