A major trend in a modern system-on-chip design is a growing system complexity, which results in a sharp increase of communication traffic on the on-chip communication bus architec...
: Thermal issue is a critical challenge in 3D IC circuit design. Incorporating thermal vias into 3D IC is a promising way to mitigate thermal issues by lowering down the thermal re...
Software maintenance is responsible for as much as two thirds of the cost of any software, and is consequently an important research area. In this paper we focus on the change pro...
Service-Oriented Computing and Agent Technology are nowadays two of the most active research fields in distributed and open systems. However, when trying to bridge the two worlds,...
The beliefs of an agent reflecting her subjective view of the world constitute one of the main components of a BDI agent. In order to incorporate new information coming from other...