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CVPR
2007
IEEE
16 years 9 months ago
3D Pose Estimation Based on Multiple Monocular Cues
In this study we propose an integrated approach to the problem of 3D pose estimation. The main difference to the majority of known methods is the usage of complementary image info...
Björn Barrois, Christian Wöhler
ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
16 years 4 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
INFOCOM
2011
IEEE
14 years 11 months ago
A high-throughput routing metric for reliable multicast in multi-rate wireless mesh networks
Abstract—We propose a routing metric for enabling highthroughput reliable multicast in multi-rate wireless mesh networks. This new multicast routing metric, called expected multi...
Xin Zhao, Jun Guo, Chun Tung Chou, Archan Misra, S...
CHI
2007
ACM
16 years 8 months ago
Work-centered design: a case study of a mixed-initiative scheduler
We present the case study of a complex, mixed-initiative scheduling system to illustrate Work-Centered Design (WCD), a new approach for the design of information systems. WCD is b...
Keith A. Butler, Jiajie Zhang, Chris Esposito, Ali...
172
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ICASSP
2007
IEEE
16 years 2 months ago
Fast Line-Based Imaging of Small Sample Features
This project aims to reduce the time required to attain more detailed scans of small interesting regions present in a quick first-pass sample image. In particular, we concentrate...
Mark A. Iwen, Gurjit S. Mandair, Michael D. Morris...