In this study we propose an integrated approach to the problem of 3D pose estimation. The main difference to the majority of known methods is the usage of complementary image info...
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Abstract—We propose a routing metric for enabling highthroughput reliable multicast in multi-rate wireless mesh networks. This new multicast routing metric, called expected multi...
Xin Zhao, Jun Guo, Chun Tung Chou, Archan Misra, S...
We present the case study of a complex, mixed-initiative scheduling system to illustrate Work-Centered Design (WCD), a new approach for the design of information systems. WCD is b...
Keith A. Butler, Jiajie Zhang, Chris Esposito, Ali...
This project aims to reduce the time required to attain more detailed scans of small interesting regions present in a quick first-pass sample image. In particular, we concentrate...
Mark A. Iwen, Gurjit S. Mandair, Michael D. Morris...