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    WSC
    1998
    106views Modeling And Simulation» more  WSC 1998»
    Multi-factor Analysis of Firm-level Performance through Feed-forward, Feed-back Relationships
    15 years 7 months ago
    Multi-factor Analysis of Firm-level Performance through Feed-forward, Feed-back Relationships
    Download  www.informs-sim.org
    This article presents the results of research to develop a descriptive model of firm-level productivity that will allow a myriad of factor interactions to be directly accounted fo...
    Young H. Park, David M. Miller
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    MSWIM
    2004
    ACM
    106views Modeling and Simulation» more  MSWIM 2004»
    Performance analysis of the mobile IP fast authentication protocol
    15 years 12 months ago
    Performance analysis of the mobile IP fast authentication protocol
    Download  www-ihs.theoinf.tu-ilmenau.de
    Ali Diab, Andreas Mitschele-Thiel, Jingan Xu
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    AMC
    2011
    189views Modeling And Simulation» more  AMC 2011»
    Performance analysis of the AM-SG parameter estimation for multivariable systems
    15 years 1 months ago
    Performance analysis of the AM-SG parameter estimation for multivariable systems
    Download  www.ece.ualberta.ca
    Heqiang Han, Guanglei Song, Yongsong Xiao, Yuwu Li...
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    SMA
    2008
    ACM
    119views Solid Modeling» more  SMA 2008»
    Converting a tetrahedral mesh to a prism-tetrahedral hybrid mesh for FEM accuracy and efficiency
    15 years 6 months ago
    Converting a tetrahedral mesh to a prism-tetrahedral hybrid mesh for FEM accuracy and efficiency
    Download  cielab3.me.cmu.edu
    This paper presents a computational method for converting a tetrahedral mesh to a prism-tetrahedral hybrid mesh for improved solution accuracy and computational efficiency of fini...
    Soji Yamakawa, Kenji Shimada
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    ISQED
    2007
    IEEE
    236views Hardware» more  ISQED 2007»
    3DFFT: Thermal Analysis of Non-Homogeneous IC Using 3D FFT Green Function Method
    16 years 22 days ago
    3DFFT: Thermal Analysis of Non-Homogeneous IC Using 3D FFT Green Function Method
    Download  vlsi.ece.wisc.edu
    Due to the roaring power dissipation and gaining popularity of 3D integration, thermal dissipation has been a critical concern of modern VLSI design. The availability for chip-lev...
    Dongkeun Oh, Charlie Chung-Ping Chen, Yu Hen Hu
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