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188
Voted
VLSID
2009
IEEE
16 years 7 months ago
2009
IEEE
The current paradigm of using Cu interconnects for on-chip global communication is rapidly becoming a serious performance bottleneck in ultra-deep submicron (UDSM) technologies. C...
182
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HPCA
2000
IEEE
15 years 11 months ago
2000
IEEE
With increasing chip densities, future microprocessor designs have the opportunity to integrate many of the traditional systemlevel modules onto the same chip as the processor. So...
164
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ICC
2007
IEEE
16 years 1 months ago
2007
IEEE
— In this paper, we study how to appropriately match users for two-user cooperative diversity systems that deploy optimal power allocation for an amplify and forward or a regener...
151
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ICANN
2005
Springer
16 years 14 days ago
2005
Springer
Despite the well-known performances and the theoretical power of neural networks, learning and generalizing are sometimes very difficult. In this article, we investigate how short ...
201
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INFOCOM
2010
IEEE
15 years 4 months ago
2010
IEEE
In this paper we consider how to efficiently identify tags on the moving conveyor. Considering conditions like the path loss and multi-path effect in realistic settings, we first p...