e Synchronization Abstractions “Well, it just so happens that your friend here is only mostly dead. There’s a big difference between mostly dead and all dead.” – Miracle Ma...
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
Recent analytical and experimental work demonstrate that IEEE 802.11-based wireless mesh networks are prone to turbulence. Manifestations of such turbulence take the form of large...
Adel Aziz, David Starobinski, Patrick Thiran, Alae...
The delay and throughput characteristics of a packet switch depend mainly on the queueing scheme and the scheduling algorithm deployed at the switch. Early research on scheduling ...
Hop-by-hop data aggregation is a very important technique for reducing the communication overhead and energy expenditure of sensor nodes during the process of data collection in a...