As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
As energy-related costs have become a major economical factor for IT infrastructures and data-centers, companies and the research community are being challenged to find better an...
—Wireless communication is particularly vulnerable to signal jamming attacks. Spread spectrum mitigates such problem by spreading normal narrowband signals over a much wider band...
—Inter-cell interference (ICI) is always a big obstacle to attain wide area coverage and high spectral efficiency in cellular systems. In this work we make a study of two well-kn...
— In order to maintain a conflict-free environment among licensed primary users (PUs) and unlicensed secondary users (SUs) in cognitive radio networks, providing frequency and g...