1928 search results - page 127 / 386 » Integrity Constraints in OWL |
201
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IEEEINTERACT
2002
IEEE
15 years 12 months ago
2002
IEEE
Embedded systems require control of many concurrent real-time activities, leading to system designs which feature multiple hardware peripherals with each providing a specific, ded...
184
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CASES
2010
ACM
15 years 4 months ago
2010
ACM
3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductiv...
160
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DAC
2009
ACM
16 years 8 months ago
2009
ACM
In this work, we present a new optical routing framework, O-Router for future low-power on-chip optical interconnect integration utilizing silicon compatible nano-photonic devices...
161
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DAC
2009
ACM
16 years 1 months ago
2009
ACM
In this work, we present a new optical routing framework, O-Router for future low-power on-chip optical interconnect integration utilizing silicon compatible nano-photonic devices...
160
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ISPD
2006
ACM
16 years 28 days ago
2006
ACM
The integration of retiming and simultaneous supply/threshold voltage scaling has a potential to enable more rigorous total power reduction. However, such integration is a highly ...