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215
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DATE
2009
IEEE
16 years 2 months ago
2009
IEEE
Current trends in technology scaling foreshadow worsening transistor reliability as well as greater numbers of transistors in each system. The combination of these factors will so...
181
Voted
DATE
2009
IEEE
16 years 2 months ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...
217
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ICIW
2009
IEEE
16 years 2 months ago
2009
IEEE
— Supporting business services through Web service compositions (WSC) as part of service-oriented architectures (SOA) involves business performance monitoring requirements. Their...
342
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AMMA
2009
Springer
16 years 2 months ago
2009
Springer
Abstract. In this paper, we report on the design of a novel market-based approach for decentralised scheduling across multiple factories. Specifically, because of the limitations ...
175
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WASA
2009
Springer
16 years 2 months ago
2009
Springer
Abstract. Increasingly ubiquitous wireless technologies require novel localization techniques to pinpoint the position of an uncooperative node, whether the target be a malicious d...