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171
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ICCAD
2008
IEEE
16 years 3 months ago
2008
IEEE
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
150
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ICCAD
2007
IEEE
16 years 3 months ago
2007
IEEE
— The paper addresses the problem of performance optimization for a set of periodic tasks with discrete voltage/frequency states under thermal constraints. We prove that the prob...
186
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ICCAD
2007
IEEE
16 years 3 months ago
2007
IEEE
While the increasing need for addressing process variability in sub-90nm VLSI technologies has sparkled a large body of statistical timing and optimization research, the realizati...
163
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ICCAD
2005
IEEE
16 years 3 months ago
2005
IEEE
Large-scale process fluctuations in nano-scale IC technologies suggest applying high-order (e.g., quadratic) response surface models to capture the circuit performance variations....
166
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ICCAD
2003
IEEE
16 years 3 months ago
2003
IEEE
Static timing analysis is a critical step in design of any digital integrated circuit. Technology and design trends have led to significant increase in environmental and process v...