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DAC
2012
ACM
13 years 9 months ago
Exploiting die-to-die thermal coupling in 3D IC placement
In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...
Krit Athikulwongse, Mohit Pathak, Sung Kyu Lim
3DIM
2007
IEEE
16 years 1 months ago
3D Challenges and a Non-In-Depth Overview of Recent Progress
Although a lot of effort already went into the development of 3D acquisition technology, and existing methods come of age, several challenges remain. We try to give a – probably...
Luc J. Van Gool, Bastian Leibe, Pascal Müller...
CHI
1997
ACM
15 years 11 months ago
Overlaying Motion, Time and Distance in 3-Space
An innovative method for visually and functionally combining the elements of motion, time and distance in a three-dimensional computer animation is presented. At a glance, the ela...
Mike Pell
CORR
2008
Springer
135views Education» more  CORR 2008»
15 years 7 months ago
The Isomorphism Problem for Planar 3-Connected Graphs is in Unambiguous Logspace
The isomorphism problem for planar graphs is known to be efficiently solvable. For planar 3-connected graphs, the isomorphism problem can be solved by efficient parallel algorithm...
Thomas Thierauf, Fabian Wagner
CVPR
2006
IEEE
16 years 9 months ago
Vessel Crawlers: 3D Physically-based Deformable Organisms for Vasculature Segmentation and Analysis
We present a novel approach to the segmentation and analysis of vasculature from volumetric medical image data. Our method is an adoption and significant extension of deformable o...
Chris McIntosh, Ghassan Hamarneh