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SLIP
2009
ACM
16 years 2 months ago
Through-silicon-via aware interconnect prediction and optimization for 3D stacked ICs
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
Dae Hyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
IEEEARES
2008
IEEE
16 years 1 months ago
Context Ontology for Secure Interoperability
During interoperability exchanges, organizations are jointly conducting computation and sharing tasks. However, organizations can have different security policies. To guarantee g...
Céline Coma, Nora Cuppens-Boulahia, Fr&eacu...
ADMA
2008
Springer
114views Data Mining» more  ADMA 2008»
16 years 1 months ago
Using Data Mining Methods to Predict Personally Identifiable Information in Emails
Private information management and compliance are important issues nowadays for most of organizations. As a major communication tool for organizations, email is one of the many pot...
Liqiang Geng, Larry Korba, Xin Wang, Yunli Wang, H...
AIME
2007
Springer
16 years 1 months ago
Using Semantic Web Technologies for Knowledge-Driven Querying of Biomedical Data
Software applications that work with biomedical data have significant knowledge-management requirements. Formal knowledge models and knowledge-based methods can be very useful in m...
Martin J. O'Connor, Ravi Shankar, Samson W. Tu, Cs...
ATAL
2007
Springer
16 years 1 months ago
Interactions between market barriers and communication networks in marketing systems
We investigate a framework where agents search for satisfying products by using referrals from other agents. Our model of a mechanism for transmitting word-of-mouth and the result...
Ian N. Durbach, Jan H. Hofmeyr