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ISLPED
2009
ACM
110views Hardware» more  ISLPED 2009»
16 years 2 months ago
SOI, interconnect, package, and mainboard thermal characterization
This paper presents an evaluation to determine the importance of the accurate thermal characterization for several elements of a semiconductor device. Specifically, it evaluates ...
Joseph Nayfach-Battilana, Jose Renau
ASPDAC
2005
ACM
125views Hardware» more  ASPDAC 2005»
16 years 1 months ago
A formalism for functionality preserving system level transformations
— With the rise in complexity of modern systems, designers are spending a significant time on at the system level of abstraction. This paper introduces Model Algebra, a formalis...
Samar Abdi, Daniel Gajski
208
Voted
MODELS
2009
Springer
16 years 2 days ago
From UML to Alloy and Back Again
Abstract. Model Transformations can be used to bridge the gap between design and analysis technical spaces by creating tools that allow a model produced by a designer to be transfo...
Seyyed M. A. Shah, Kyriakos Anastasakis, Behzad Bo...
CISSE
2007
Springer
15 years 11 months ago
Issues in Simulation for Valuing Long-Term Forwards
Abstract- This paper explores valuing long-term equity forwardcontracts or futures where both the underlying volatility and the interest rates are modeled as stochastic random vari...
Phillip G. Bradford, Alina Olteanu
WSC
1997
15 years 8 months ago
Automating the Metamodeling Process
Model abstraction using metamodeling has demonstrated the capability to facilitate software reuse, large scale model integration, verification, and validation. Once restricted to...
Don Caughlin
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