As the technology node advances into the nanometer era, via-open defects are one of the dominant failures. To improve via yield and reliability, redundant-via insertion is a highl...
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...
We previously presented a HAMMER image registration algorithm that demonstrated high accuracy in superposition of images from different individual brains. However, the HAMMER regis...
T ORDER REGRESSION (EXTENDED ABSTRACT) Kurt Driessensa Saso Dzeroskib a Department of Computer Science, University of Waikato, Hamilton, New Zealand (kurtd@waikato.ac.nz) b Departm...
In many real-world classification problems the input contains a large number of potentially irrelevant features. This paper proposes a new Bayesian framework for determining the r...
Yuan (Alan) Qi, Thomas P. Minka, Rosalind W. Picar...