Present application specific embedded systems tend to choose instruction set extensions (ISEs) based on limitations imposed by the available data bandwidth to custom functional un...
Panagiotis Athanasopoulos, Philip Brisk, Yusuf Leb...
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
As CMOS devices are scaled down into the nanometer regime, concerns about reliability are mounting. Instead of viewing nanoscale characteristics as an impediment, technologies suc...
Weikang Qian, Marc D. Riedel, Kia Bazargan, David ...
The integration of database and programming languages is made difficult by the different data models and type systems prevalent in each field. Functional-object query languages con...
Abstract--In this paper we address the task of accurately reconstructing a distributed signal through the collection of a small number of samples at a data gathering point using Co...
Riccardo Masiero, Giorgio Quer, Michele Rossi, Mic...