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GRAPHITE
2007
ACM
15 years 11 months ago
Appearance preserving octree-textures
Because of their geometric complexity, high resolution 3D models, either designed in high-end modeling packages or acquired with range scanning devices, cannot be directly used in...
Julien Lacoste, Tamy Boubekeur, Bruno Jobard, Chri...
ICCAD
2003
IEEE
190views Hardware» more  ICCAD 2003»
16 years 4 months ago
IDAP: A Tool for High Level Power Estimation of Custom Array Structures
—While array structures are a significant source of power dissipation, there is a lack of accurate high-level power estimators that account for varying array circuit implementat...
Mahesh Mamidipaka, Kamal S. Khouri, Nikil D. Dutt,...
ICRA
2008
IEEE
136views Robotics» more  ICRA 2008»
16 years 2 months ago
Generalizing the dubins and reeds-shepp cars: Fastest paths for bounded-velocity mobile robots
— What is the shortest or fastest path a mobile robot can follow between two configurations in the unobstructed plane? The answer to this fundamental question is only known anal...
Andrei A. Furtuna, Devin J. Balkcom, Hamid Reza Ch...
ATAL
2007
Springer
16 years 1 months ago
On Revenue-Optimal Dynamic Auctions for Bidders with Interdependent Values
In a dynamic market, being able to update one’s value based on information available to other bidders currently in the market can be critical to having profitable transactions. ...
Florin Constantin, David C. Parkes
ISLPED
2006
ACM
99views Hardware» more  ISLPED 2006»
16 years 1 months ago
Thermal via allocation for 3D ICs considering temporally and spatially variant thermal power
All existing methods for thermal-via allocation are based on a steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and ...
Hao Yu, Yiyu Shi, Lei He, Tanay Karnik