6251 search results - page 869 / 1251 » Randomness, Computability, and Density |
214
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DAC
2009
ACM
16 years 8 months ago
2009
ACM
Three-dimensional integrated circuits (3D ICs) offer a promising solution to overcome the on-chip communication bottleneck and improve performance over traditional two-dimensional...
238
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DAC
2009
ACM
16 years 8 months ago
2009
ACM
Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...
194
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DAC
2008
ACM
16 years 8 months ago
2008
ACM
Intrinsic and parasitic capacitances play an important role in determining the high?frequency RF performance of devices. Recently, a new type of carbon nanotube field effect trans...
202
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DAC
2007
ACM
16 years 8 months ago
2007
ACM
Due to shrinking technology, increasing functional frequency and density, and reduced noise margins with supply voltage scaling, the sensitivity of designs to supply voltage noise...
203
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DAC
2005
ACM
16 years 8 months ago
2005
ACM
ASIC provides more than an order of magnitude advantage in terms of density, speed, and power requirement per gate. However, economic (cost of masks) and technological (deep micro...