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ASPDAC
2005
ACM
134views Hardware» more  ASPDAC 2005»
16 years 1 months ago
Wire congestion and thermal aware 3D global placement
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
Karthik Balakrishnan, Vidit Nanda, Siddharth Easwa...
LCTRTS
2004
Springer
16 years 29 days ago
Link-time optimization of ARM binaries
The overhead in terms of code size, power consumption and execution time caused by the use of precompiled libraries and separate compilation is often unacceptable in the embedded ...
Bruno De Bus, Bjorn De Sutter, Ludo Van Put, Domin...
GLVLSI
2010
IEEE
136views VLSI» more  GLVLSI 2010»
16 years 21 days ago
Thermal-aware compilation for system-on-chip processing architectures
The development of compiler-based mechanisms to reduce the percentage of hotspots and optimize the thermal profile of large register files has become an important issue. Thermal...
Mohamed M. Sabry, José L. Ayala, David Atie...
IWDC
2001
Springer
146views Communications» more  IWDC 2001»
16 years 1 days ago
Aggregated Multicast for Scalable QoS Multicast Provisioning
Abstract. IP multicast suffers from scalability problem with the number of concurrently active multicast groups, while scalability of QoS multicast is even further from being solve...
Mario Gerla, Aiguo Fei, Jun-Hong Cui, Michalis Fal...
MICRO
1997
IEEE
139views Hardware» more  MICRO 1997»
15 years 11 months ago
The Filter Cache: An Energy Efficient Memory Structure
Most modern microprocessors employ one or two levels of on-chip caches in order to improve performance. These caches are typically implemented with static RAM cells and often occu...
Johnson Kin, Munish Gupta, William H. Mangione-Smi...