— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
The overhead in terms of code size, power consumption and execution time caused by the use of precompiled libraries and separate compilation is often unacceptable in the embedded ...
Bruno De Bus, Bjorn De Sutter, Ludo Van Put, Domin...
The development of compiler-based mechanisms to reduce the percentage of hotspots and optimize the thermal profile of large register files has become an important issue. Thermal...
Abstract. IP multicast suffers from scalability problem with the number of concurrently active multicast groups, while scalability of QoS multicast is even further from being solve...
Mario Gerla, Aiguo Fei, Jun-Hong Cui, Michalis Fal...
Most modern microprocessors employ one or two levels of on-chip caches in order to improve performance. These caches are typically implemented with static RAM cells and often occu...
Johnson Kin, Munish Gupta, William H. Mangione-Smi...