6147 search results - page 1089 / 1230 » Requirements, Architectures and Risks |
196
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ICCD
2003
IEEE
16 years 3 months ago
2003
IEEE
With the circuit density available in today’s ASIC design systems, increased integration is possible creating more complexity in the design of a System on a Chip (SoC). IBM’s ...
222
Voted
ICCD
2002
IEEE
16 years 3 months ago
2002
IEEE
A large and increasing number of modern embedded systems are subject to tight power/energy constraints. It has been demonstrated that the operating system (OS) can have a signifi...
179
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ICCAD
2006
IEEE
16 years 3 months ago
2006
IEEE
Temperature monitoring using thermal sensors is an essential tool for evaluating the thermal behavior and sustaining the reliable operation in high-performance and high-power syst...
170
Voted
ICCAD
2003
IEEE
16 years 3 months ago
2003
IEEE
— In this paper, we present a high-level power model to estimate the power consumption in semi-global and global interconnects. Such interconnects are used for communications bet...
183
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IPSN
2010
Springer
16 years 1 months ago
2010
Springer
A key problem in sensor networks is to decide which sensors to query when, in order to obtain the most useful information (e.g., for performing accurate prediction), subject to co...