— The influence of interconnects on processor performance and cost is becoming increasingly pronounced with technology scaling. In this paper, we present a fast compression sche...
Jiangjiang Liu, Krishnan Sundaresan, Nihar R. Maha...
— In today’s VLSI designs, there can be many blockages in a routing region. The obstacle-avoiding rectilinear Steiner minimum tree (OARSMT) problem has become an important prob...
— Leveraging the power of scratchpad memories (SPMs) available in most embedded systems today is crucial to extract maximum performance from application programs. While regular a...
Taylan Yemliha, Shekhar Srikantaiah, Mahmut T. Kan...
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. ...
— Energy efficiency has become one of the most important issues to be addressed in today’s System-on-a-Chip (SoC) designs. One way to lower the power consumption is to reduce ...