4524 search results - page 702 / 905 » The Complexity of Global Constraints |
195
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ICCAD
2005
IEEE
16 years 4 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
213
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ICDE
2009
IEEE
16 years 2 months ago
2009
IEEE
— We present SMART, a self-tuning, bandwidth-aware monitoring system that maximizes result precision of continuous aggregate queries over dynamic data streams. While prior approa...
241
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EWSN
2009
Springer
16 years 2 months ago
2009
Springer
In this paper we present SCOPES, a distributed Smart Camera Object Position Estimation sensor network System that provides maps of distribution of people in indoors environments. ...
209
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ISCA
2009
IEEE
16 years 1 months ago
2009
IEEE
Industry has shifted towards multi-core designs as we have hit the memory and power walls. However, single thread performance remains of paramount importance since some applicatio...
191
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PKDD
2009
Springer
16 years 1 months ago
2009
Springer
In this paper we introduce graph-evolution rules, a novel type of frequency-based pattern that describe the evolution of large networks over time, at a local level. Given a sequenc...