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ESWA
2008
166views more  ESWA 2008»
15 years 6 months ago
Modular design to support green life-cycle engineering
The severe competition in the market has driven enterprises to produce a wider variety of products to meet consumers' needs. However, frequent variation of product specificat...
Hwai-En Tseng, Chien-Chen Chang, Jia-Diann Li
ICCAD
1994
IEEE
144views Hardware» more  ICCAD 1994»
15 years 11 months ago
Power analysis of embedded software: a first step towards software power minimization
Embedded computer systems are characterized by the presence of a dedicated processor and the software that runs on it. Power constraints are increasingly becoming the critical com...
Vivek Tiwari, Sharad Malik, Andrew Wolfe
GECCO
2005
Springer
136views Optimization» more  GECCO 2005»
16 years 14 days ago
Incorporating fuzzy knowledge into fitness: multiobjective evolutionary 3D design of process plants
Designing technical plants is a complex and demanding process. It has been shown that the optimization of the simple facility placement problem is already NP-hard. Optimization of...
Ingo Mierswa
ICCAD
2009
IEEE
154views Hardware» more  ICCAD 2009»
15 years 4 months ago
Pad assignment for die-stacking System-in-Package design
Wire bonding is the most popular method to connect signals between dies in System-in-Package (SiP) design nowadays. Pad assignment, which assigns inter-die signals to die pads so ...
Yu-Chen Lin, Wai-Kei Mak, Chris Chu, Ting-Chi Wang
DAC
2000
ACM
15 years 11 months ago
Macro-driven circuit design methodology for high-performance datapaths
Datapath design is one of the most critical elements in the design of a high performance microprocessor. However datapath design is typically done manually, and is often custom st...
Mahadevamurty Nemani, Vivek Tiwari