This paper looks at the CAD implications of possible new interconnect technologies. We consider three technologies in particular: three dimensional ICs, carbon nanotubes as a repl...
With the continuous increase of circuit density, interconnect length, and aspect ratio, the influence of capacitive and inductive coupling on timing characteristics of integrated ...
Coverage is a means to quantify the quality of a system specification, and is frequently applied to assess progress in system validation. Coverage is a standard measure in testin...
Power grid verification in modern integrated circuits is an integral part of early system design where adjustments can be most easily incorporated. In this work, we describe an ea...
Low power consumption and high-performance are two main directions in the development of modern microprocessor architectures. In general they are two excluding branches of System-o...
Krzysztof Marcinek, Arkadiusz W. Luczyk, Witold A....