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DAC
2007
ACM
15 years 11 months ago
CAD Implications of New Interconnect Technologies
This paper looks at the CAD implications of possible new interconnect technologies. We consider three technologies in particular: three dimensional ICs, carbon nanotubes as a repl...
Louis Scheffer
DAC
2007
ACM
15 years 11 months ago
Effects of Coupling Capacitance and Inductance on Delay Uncertainty and Clock Skew
With the continuous increase of circuit density, interconnect length, and aspect ratio, the influence of capacitive and inductive coupling on timing characteristics of integrated ...
Abinash Roy, Noha H. Mahmoud, Masud H. Chowdhury
DAC
2010
ACM
15 years 11 months ago
Coverage in interpolation-based model checking
Coverage is a means to quantify the quality of a system specification, and is frequently applied to assess progress in system validation. Coverage is a standard measure in testin...
Hana Chockler, Daniel Kroening, Mitra Purandare
DAC
2009
ACM
15 years 11 months ago
Fast vectorless power grid verification using an approximate inverse technique
Power grid verification in modern integrated circuits is an integral part of early system design where adjustments can be most easily incorporated. In this work, we describe an ea...
Nahi H. Abdul Ghani, Farid N. Najm
DDECS
2009
IEEE
146views Hardware» more  DDECS 2009»
15 years 11 months ago
Enhanced LEON3 core for superscalar processing
Low power consumption and high-performance are two main directions in the development of modern microprocessor architectures. In general they are two excluding branches of System-o...
Krzysztof Marcinek, Arkadiusz W. Luczyk, Witold A....