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FPGA
2008
ACM
145views FPGA» more  FPGA 2008»
15 years 8 months ago
FPGA interconnect design using logical effort
Logical effort (LE) is a linear technique for modelling the delay of a circuit in a technology independent manner. It offers the potential to simplify delay models for FPGAs and g...
Haile Yu, Yuk Hei Chan, Philip Heng Wai Leong
CORR
2007
Springer
106views Education» more  CORR 2007»
15 years 7 months ago
Nano-Sim: A Step Wise Equivalent Conductance based Statistical Simulator for Nanotechnology Circuit Design
: New nanotechnology based devices are replacing CMOS devices to overcome CMOS technology’s scaling limitations. However, many such devices exhibit nonmonotonic I-V characteristi...
Bharat Sukhwani, Uday Padmanabhan, Janet Meiling W...
HPCA
2009
IEEE
16 years 7 months ago
A low-radix and low-diameter 3D interconnection network design
Interconnection plays an important role in performance and power of CMP designs using deep sub-micron technology. The network-on-chip (NoCs) has been proposed as a scalable and hi...
Bo Zhao, Jun Yang 0002, Xiuyi Zhou, Yi Xu, Youtao ...
DATE
2009
IEEE
141views Hardware» more  DATE 2009»
16 years 2 months ago
Design of compact imperfection-immune CNFET layouts for standard-cell-based logic synthesis
– The quest for technologies with superior device characteristics has showcased Carbon Nanotube Field Effect Transistors (CNFETs) into limelight. Among the several design aspects...
Shashikanth Bobba, Jie Zhang, Antonio Pullini, Dav...
DSD
2009
IEEE
84views Hardware» more  DSD 2009»
16 years 2 months ago
Temperature- and Cost-Aware Design of 3D Multiprocessor Architectures
— 3D stacked architectures provide significant benefits in performance, footprint and yield. However, vertical stacking increases the thermal resistances, and exacerbates tempe...
Ayse Kivilcim Coskun, Andrew B. Kahng, Tajana Simu...