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183
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DAC
2006
ACM
16 years 8 months ago
2006
ACM
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
183
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DAC
2006
ACM
16 years 8 months ago
2006
ACM
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
220
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DAC
2006
ACM
16 years 8 months ago
2006
ACM
Networks-on-Chip (NoC) architectures provide a scalable solution to on-chip communication problem but the bandwidth offered by NoCs can be utilized efficiently only in presence of...
202
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DAC
2006
ACM
16 years 8 months ago
2006
ACM
Existing approaches to timing analysis under uncertainty are based on restrictive assumptions. Statistical STA techniques assume that the full probabilistic distribution of parame...
252
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DAC
2006
ACM
16 years 8 months ago
2006
ACM
Recent progress on nanodevices, such as carbon nanotubes and nanowires, points to promising directions for future circuit design. However, nanofabrication techniques are not yet m...