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CODES
2007
IEEE
16 years 1 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
CODES
2007
IEEE
16 years 1 months ago
Performance modeling for early analysis of multi-core systems
Performance analysis of microprocessors is a critical step in defining the microarchitecture, prior to register-transfer-level (RTL) design. In complex chip multiprocessor systems...
Reinaldo A. Bergamaschi, Indira Nair, Gero Dittman...
CVPR
2007
IEEE
16 years 1 months ago
Visual Event Recognition in News Video using Kernel Methods with Multi-Level Temporal Alignment
In this work, we systematically study the problem of visual event recognition in unconstrained news video sequences. We adopt the discriminative kernel-based method for which vide...
Dong Xu, Shih-Fu Chang
ICASSP
2007
IEEE
16 years 1 months ago
Fast Line-Based Imaging of Small Sample Features
This project aims to reduce the time required to attain more detailed scans of small interesting regions present in a quick first-pass sample image. In particular, we concentrate...
Mark A. Iwen, Gurjit S. Mandair, Michael D. Morris...
ICC
2007
IEEE
193views Communications» more  ICC 2007»
16 years 1 months ago
A Semantic Context Model for Location-Based Cooperative Mobile Computing
—This paper addresses context issues in pervasive mobile computing and presents a semantic context model to support location based cooperative mobile applications. In this paper,...
Bin Hu, Philip Moore, Hsiai-Hwa Chen