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TCAD
2008
93views more  TCAD 2008»
15 years 7 months ago
Chip Optimization Through STI-Stress-Aware Placement Perturbations and Fill Insertion
Starting at the 65-nm node, stress engineering to improve the performance of transistors has been a major industry focus. An intrinsic stress source--shallow trench isolation (STI)...
Andrew B. Kahng, Puneet Sharma, Rasit Onur Topalog...
TCAD
2008
106views more  TCAD 2008»
15 years 7 months ago
Track Routing and Optimization for Yield
Abstract--In this paper, we propose track routing and optimization for yield (TROY), the first track router for the optimization of yield loss due to random defects. As the probabi...
Minsik Cho, Hua Xiang, Ruchir Puri, David Z. Pan
INFORMATICALT
2007
164views more  INFORMATICALT 2007»
15 years 7 months ago
Extracting Personalised Ontology from Data-Intensive Web Application: an HTML Forms-Based Reverse Engineering Approach
The advance of the Web has significantly and rapidly changed the way of information organization, sharing and distribution. The next generation of the web, the semantic web, seeks...
Sidi Mohamed Benslimane, Mimoun Malki, Mustapha Ka...
INFORMATICALT
2007
97views more  INFORMATICALT 2007»
15 years 7 months ago
Fabric Level and Application Level QoS Guarantees in Grid Computing
In the paper, a cross-layer optimization between application layer and fabric layer is proposed. The aim is to optimize the end-to-end quality of the dynamic grid application as we...
Li Chunlin, Li Layuan
TCAD
2008
115views more  TCAD 2008»
15 years 7 months ago
Statistical Thermal Profile Considering Process Variations: Analysis and Applications
The nonuniform substrate thermal profile and process variations are two major concerns in the present-day ultradeep submicrometer designs. To correctly predict performance/ leakage...
Javid Jaffari, Mohab Anis